Security arrangement for integrated circuits using arrays of capacitive elements
AssigneeInternational Business Machines Corporation
InventorsMatthew S. Doyle, Jeffrey N. Judd, Scott D. Strand
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AssigneeInternational Business Machines Corporation
InventorsMatthew S. Doyle, Jeffrey N. Judd, Scott D. Strand
Estimating the term…
An apparatus is disclosed that comprises a first security arrangement that overlaps a plurality of electronic components arranged within one or more layers. The first security arrangement comprises a first conductive layer patterned as a first array of a plurality of first conductive elements, and a second conductive layer separated from the first conductive layer by a dielectric layer. The second conductive layer patterned as a second array of a plurality of second conductive elements, and the first array and the second array collectively form a plurality of capacitive elements. The apparatus further comprises monitoring circuitry coupled with the first security arrangement and configured to detect a change in a capacitance of a first capacitive element of the plurality of capacitive elements, and determine, based on a location of the first capacitive element within the first array, whether to perform a predefined security action.
An apparatus comprising:
An integrated circuit defining one or more exterior surfaces, the integrated circuit comprising:
A method for use with a security arrangement that overlaps a plurality of electronic components, the plurality of electronic components arranged within one or more layers of an integrated circuit, the security arrangement comprising a first conductive layer electrically insulated from a second conductive layer, the method comprising:
Dependencies are inferred from the claim text.