Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof

A manufacturing method of a semiconductor package, comprising:

• disposing a semiconductor die in a cavity of a conductive casing;
• forming a conductive connector on a periphery of the conductive casing;
• forming an insulating encapsulant to encapsulate the conductive casing, the semiconductor die and the cavity, wherein the insulating encapsulant exposes a first conductive surface of the conductive casing, and the first conductive surface of the conductive casing is substantially coplanar with a first insulating surface of the insulating encapsulant;
• forming a redistribution structure on the first insulating surface of the insulating encapsulant, wherein the redistribution structure is electrically coupled to the conductive connector and the semiconductor die, and the redistribution structure has an opening exposing the first conductive surface of the conductive casing;
• and
• forming a first conductive terminal in the opening of the redistribution structure, wherein the first conductive terminal penetrates through the redistribution structure and directly contacts the first conductive surface of the conductive casing, and a height of the first conductive terminal is greater than a thickness of the redistribution structure.