Three dimensional storage cell array with highly dense and scalable word line design approach
AssigneeIntel Corporation
InventorsDeepak Thimmegowda, Aaron Yip, Mark Helm, Yongna Li
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AssigneeIntel Corporation
InventorsDeepak Thimmegowda, Aaron Yip, Mark Helm, Yongna Li
Estimating the term…
An apparatus is described. The apparatus includes a three dimensional storage cell array structure. The apparatus also includes a staircase structure having alternating conductive and dielectric layers, wherein respective word lines are formed in the conductive layers. The word lines are connected to respective storage cells within the three dimensional storage cell array structure. The apparatus also includes upper word lines above the staircase structure that are connected to first vias that connect to respective steps of the staircase structure. The upper word lines are also connected to second vias that run vertically off a side of the staircase structure other than a side opposite the three dimensional storage cell array structure. The second vias are connected to respective word line driver transistors that are disposed beneath the staircase structure.
A method, comprising:
Dependencies are inferred from the claim text.