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US 10,593,617 B2Granted
Semiconductor device
AssigneeToshiba Memory Corporation
InventorsHiroshi Ashikaga, Naoki Kimura
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a semiconductor device includes a first board including a plurality of terminals, a semiconductor chip flip-chip mounted to the first board, and an insulating layer covering the first board and the semiconductor chip. The plurality of terminals include at least one first terminal electrically connected to the semiconductor chip, and at least one second terminal that is not connected to the semiconductor chip, wherein the at least one second terminal is not covered by the insulating layer.
Claims19
A semiconductor device, comprising:
- a first board including a plurality of vias;
- a semiconductor chip flip-chip mounted to the first board;
- an insulating layer covering the first board and the semiconductor chip;
- and
- a second board electrically connected to the first board and including a ground terminal thereon, wherein
- the plurality of vias include a first via electrically connected to the semiconductor chip;
- and a second via that is not electrically connected to the semiconductor chip,
- the insulating layer includes an opening at a position above the second via, the second via is not covered by the insulating layer, and a conductive portion is disposed in the opening of the insulating layer,
- an upper surface of the conductive portion is flush with an upper surface of the insulating layer, and
- the conductive portion has a thickness less than a thickness of the semiconductor chip above the first board and is electrically connected to the ground terminal of the second board through the second via.
7 more elements
A semiconductor device, comprising:
- a first board including a ground terminal;
- and
- a first semiconductor component mounted on the first board, wherein
- the first semiconductor component comprises:
- a second board having a plurality of vias;
- a semiconductor chip flip-chip mounted to the second board;
- and
- an insulating layer covering the second board and the semiconductor chip, wherein
- the plurality of vias of the second board include:
- a first via electrically connected to the semiconductor chip;
- and
- a second via that is not electrically connected to the semiconductor chip,
- the insulating layer includes an opening at a position above the second via, the second via is not covered with the insulating layer, and a conductive portion is disposed in the opening of the insulating layer,
- an upper surface of the conductive portion is flush with an upper surface of the insulating layer, and
- the conductive portion has a thickness less than a thickness of the semiconductor chip above the second board and is electrically connected to the ground terminal of the first board through the second via.
12 more elements
A semiconductor device, comprising:
- a first board comprising a first surface, a second surface, and a body extending therebetween bounded by a perimeter, a first conductive path extending therethrough in a first region of the board and a second conductive path extending therethrough in a second region of the board;
- a semiconductor chip flip-chip mounted over the first region of the first surface of the first board, wherein the semiconductor chip is electrically connected to the first conductive path;
- a coating covering the semiconductor chip and the first surface of the first board in a region where the semiconductor chip is not mounted thereover;
- and
- a first conductor extending through the coating and in electric contact with the second conductive path in the second region, wherein a surface of the first conductor spaced from the first surface of the first board is exposed at and flush with a surface of the coating spaced from the first surface of the first board, the first conductor has a thickness less than a thickness of the semiconductor chip, and the first conductor is electrically connected to ground through the second conductive path.
2 more elements
Dependencies are inferred from the claim text.