SMDs integration on QFN by 3D stacked solution
AssigneeSTMicroelectronics S.r.l.
InventorsCristina Somma, Fulvio Vittorio Fontana
Life of this patent
Estimating the term…
Abstract
One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.
Claims20
A device, comprising:
- a die pad;
- a lead spaced apart from the die pad;
- an electrical component having a first contact on the die pad and a second contact on the lead, the first contact and the second contact positioned on a first side of the electrical component at opposite ends of the electrical component;
- a semiconductor die on a second side of the electrical component that is opposite the first side, the semiconductor die spaced apart from the die pad by the electrical component, and only an outer portion of the semiconductor die overlying the electrical component;
- and
- a conductive wire, the semiconductor die being electrically coupled to the lead by the conductive wire.
A device, comprising:
- a die pad, the die pad including a recessed portion;
- a lead spaced apart from the die pad, the lead including a recessed portion adjacent to and aligned with the recessed portion of the die pad;
- an electrical component having a first contact electrically coupling a first end portion of the electric component to a recessed surface of the recessed portion of the die pad and a second contact electrically coupling a second end portion of the electrical component to a recessed surface of the recessed portion of the lead, the second end portion opposite the first end portion;
- and
- a semiconductor die over the electrical component, the semiconductor die spaced apart from the die pad by the electrical component.
A device, comprising:
- a die pad including a plurality of recessed portions;
- a plurality of recessed leads along a periphery of the die pad and spaced from the die pad, each of the plurality of recessed leads having a recessed portion adjacent to and aligned with a respective one of the plurality of recessed portions of the die pad;
- a plurality of electrical components, each of the plurality of electrical components positioned over a respective one of the plurality of recessed portions of the die pad and the recessed portion of a respective one of the plurality of recessed leads;
- a plurality of first contacts, each of the plurality of first contacts electrically coupling a first end of a respective one of the plurality of electrical components to a recessed surface of the recessed portion of a respective one of the plurality of recessed leads;
- a plurality of second contacts, each of the plurality of second contacts electrically coupling a second end of a respective one of the plurality of electrical components to a recessed surface of a respective one of the plurality of recessed portions of the die pad;
- and
- a semiconductor die over the plurality of electrical components.
Dependencies are inferred from the claim text.