Semiconductor device and power converter
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsYuji Nishibe, Yasuyuki Kageyama, Yasuyoshi Saito, Shinichi Miura, Yasuhide Yagyu
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Abstract
A semiconductor device includes: at least one power semiconductor element; a sealing resin disposed so as to seal the power semiconductor element; and a plurality of electrical terminals each electrically connected to the power semiconductor element and each including a protrusion protruding from a surface of the sealing resin. The protrusion includes a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape.
Claims5
A semiconductor device comprising:
- at least one power semiconductor element;
- a sealing resin disposed so as to seal the power semiconductor element;
- and
- a plurality of electrical terminals each electrically connected to the power semiconductor element and each including a protrusion protruding from a surface of the sealing resin, wherein
- the protrusion includes a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape,
- the protrusion includes a second part having a flat plate shape, and the second part is provided on a side of a leading end of the first part in the protrusion direction, and
- the second part is disposed at an outermost part of the protrusion.
A power converter comprising:
- a plurality of semiconductor devices stacked with a cooler sandwiched in between, each of the semiconductor devices including:
- at least one power semiconductor element;
- a sealing resin disposed so as to seal the power semiconductor element;
- and
- a plurality of electrical terminals each electrically connected to the power semiconductor element and each having a protrusion protruding from a surface of the sealing resin, wherein the protrusion includes:
- a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape,
- a second part that has a flat plate shape and is provided on a side of a leading end of the first part in the protrusion direction, and
- the second part is disposed at an outermost part of the protrusion.
A semiconductor device comprising:
- at least one power semiconductor element;
- a sealing resin disposed so as to seal the power semiconductor element;
- and
- a plurality of electrical terminals each electrically connected to the power semiconductor element and each including a protrusion protruding from a surface of the sealing resin, wherein
- the protrusion includes a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape,
- the protrusion includes a second part having a flat plate shape, and the second part is provided on a side of a leading end of the first part in the protrusion direction,
- an area of a cross-section of the first part intersecting the protrusion direction and an area of a cross-section of the second part intersecting the protrusion direction are equal, and
- the second part is disposed at an outermost part of the protrusion.
Dependencies are inferred from the claim text.