Build-up package for integrated circuit devices, and methods of making same

A packaged integrated circuit device, comprising:

• a die having a first lateral perimeter and an active surface;
• a bond pad on the active surface;
• a layer of insulating material on the active surface, the layer of insulating material being narrower than the first lateral perimeter of the die, wherein the layer of insulating material has a first surface contacting the bond pad and completely covering the bond pad, and a second surface opposite the first surface, wherein the layer of insulating material defines an interface by inwardly removing a portion of the insulating material to a predetermined width;
• a molded body contacting the first lateral perimeter of the die, the layer of insulating material, and a portion of the active surface of the die, the molded body having a second lateral perimeter, the molded body having a portion completely and laterally surrounding the layer of insulating material;
• and
• a tape section on the second surface of the layer of insulating material and extending beyond the second lateral perimeter of the mold body.