Wiring board, and manufacturing method

A wiring board comprising:

• a glass substrate as a core member;
• a plurality of through holes arranged in a cyclic manner in the glass substrate, wherein the through holes are filled with different kinds of filling materials, and wherein through hole groups each formed with the plurality of through holes filled with different kinds of filling materials are arranged in a cyclic manner in the glass substrate;
• a plurality of normal through electrodes formed with through holes included in the plurality of through holes that are filled with a first conductive material;
• and
• a plurality of low-expansion through electrodes formed with through holes included in the plurality of through holes that are filled with a second conductive material, the second conductive material having a linear expansion coefficient closer to a linear expansion coefficient of glass than to a linear expansion coefficient of the first conductive material, wherein the normal through electrodes and the low-expansion through electrodes are arranged in a cyclic and symmetric manner, and wherein the normal through electrodes and the low-expansion through electrodes are alternately arranged at corners and centers of regular hexagons arranged without space.