Combined wafer production method with laser treatment and temperature-induced stresses

A method for the production of layers of solid material comprising:

• at a first instance in time, providing a solid body for the separation of at least one layer of solid material, the solid body having a first level surface portion and a second level surface portion, wherein the second level surface is part of the layer of solid material, wherein the layer of solid material is thinner than the remaining part of the solid body, wherein the first level surface and the second level surface are opposing main surfaces of said solid material;
• thereafter at a second instance in time occurring after the first instance, generating defects in the solid body with at least one laser producing laser beams of multiphoton within the inner structure of the solid body to produce a detachment plane along which the layer of solid material is to be separated from the solid body, the laser beams penetrating into the solid body via the second level surface portion;
• thereafter at a third instance in time occurring after the second instance, providing a receiving layer for holding the layer of solid material on the solid body, the receiving layer being disposed on the second level surface portion and the receiving layer being in the form of a polymer layer;
• thereafter at a fourth instance in time occurring after the second instance, subjecting the receiving layer to temperature conditions in order to generate mechanical stresses in the solid body, including cooling of the receiving layer to a temperature below ambient temperature, the cooling taking place such that at least part of the polymer layer undergoes a glass transition and a crack propagates in the solid body along the detachment plane due to stresses, the crack separating the layer of solid material from the solid body, and
• wherein the defects are generated in different concentrations in the detachment plane.