Systems and methods for controlling substrate approach toward a target horizontal plane
AssigneeLam Research Corporation
InventorsDouglas Hill, Cian Sweeney, Manish Ranjan
Life of this patent
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AssigneeLam Research Corporation
InventorsDouglas Hill, Cian Sweeney, Manish Ranjan
Estimating the term…
A determination is made of a real-time azimuthal position of a notch alignment feature located on a support surface of a substrate holder relative to a fixed reference ray extending perpendicularly away from a rotational axis of the substrate holder as the substrate holder rotates about the rotational axis. A determination is made of an approach initiation azimuthal position of the notch alignment feature relative to the fixed reference ray at which vertical movement of the substrate holder should initiate in order to have the notch alignment feature located at a prescribed azimuthal position relative to the fixed reference ray when the substrate holder reaches a prescribed vertical position. A determination is made of a time delay required to have the notch alignment feature located at the approach initiation azimuthal position. Vertical movement of the substrate holder is initiated in accordance with the determined time delay.
An electroplating system, comprising:
A system for controlling substrate approach toward a target horizontal plane, comprising:
A method for controlling an approach of a substrate toward a target horizontal plane, comprising:
Dependencies are inferred from the claim text.