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US 10,593,581 B2Granted
Transfer head and method for transferring micro devices
AssigneeMikro Mesa Technology Co., Ltd.
InventorLi-Yi Chen
Life of this patent
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Abstract
A transfer head is provided. The transfer head includes a body having a plurality of arrays of grip regions with each of the arrays comprising at least two columns of the grip regions. The grip regions in one of the columns are electrically connected in series. The columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.
Claims7
A transfer head, comprising:
- a body having a plurality of arrays of grip regions with each of the arrays comprising at least two columns of the grip regions, wherein the grip regions in one of the columns are electrically connected in series and restricted to be controlled in one phase, the columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively;
- the body further having a plurality of recesses, one of the recesses is present between the grip regions in adjacent two of the columns, or one of the columns is present between adjacent two of the recesses, wherein one of the recesses is isolated from other recesses.
Dependencies are inferred from the claim text.