Techniques for combining CMP process tracking data with 3D printed CMP consumables

A chemical mechanical polishing system, comprising:

• a platen having a supporting surface;
• a printed polishing pad having a radio frequency identification (RFID) tag disposed therein, wherein the RFID tag stores a plurality of information associated with properties of the printed polishing pad, the printed polishing pad being disposed over the supporting surface of the platen and comprising:
• a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings;
• and
• one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, the plurality of polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height, and wherein the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;
• an interrogator coupled to the platen, wherein the interrogator and the RFID tag are configured to communicate with one another using a wireless communication technique;
• and
• a polishing head positioned opposite the platen, wherein the polishing head is configured to urge a substrate against the polishing surface of the printed polishing pad.

A method of polishing a substrate, comprising:

• sensing one or more processing parameters with a radio frequency identification (RFID) tag disposed within a printed polishing pad, the RFID tag being communicatively coupled to a sensor disposed within the printed polishing pad, the printed polishing pad comprising:
• a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings;
• and
• one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface and the one or more base features and the one or more polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;
• receiving, via an interrogator, one or more signals from the RFID tag;
• and
• communicating the one or more signals to a controller adapted to control the polishing process, wherein the controller initiates a change in the polishing process in response to receiving the one or more signals.

A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to implement a substrate polishing process, by performing the operations of:

• causing initiation of a substrate polishing process;
• receiving signals corresponding to one or more processing parameters, wherein the signals are generated by a wireless communication apparatus disposed within a printed polishing pad, the wireless communication apparatus comprising a radio frequency identification (RFID) tag and a sensor communicatively coupled to the RFID tag, the printed polishing pad comprising:
• a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric ring;
• and
• one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;
• analyzing the signals to determine processing conditions;
• and
• changing at least one of the one or more processing parameters in response to the processing conditions.

A polishing pad apparatus, comprising:

• a printed polymeric body comprising:
• a plurality of polishing features, which have a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings;
• and
• one or more base features, wherein the plurality of polishing features comprise a first material and the one or more base features comprise a second material different from the first material;
• an RFID tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface and comprises an electrically conductive polymer material;
• and
• a sensor communicatively coupled to the RFID tag, the sensor being disposed within the printed polymeric body.

A polishing pad apparatus, comprising:

• a printed polymeric body comprising:
• a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings;
• and
• one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface of the one or more polishing features, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;
• and
• an RFID tag integrally disposed within the printed polymeric body, wherein the RFID tag stores a plurality of information associated with two or more properties of the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface.

A polishing pad apparatus, comprising:

• a printed polymeric body comprising:
• a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings;
• and
• one or more base features comprising a second material different than the first material,
• wherein:
• the one or more base features are disposed a distance from the polishing surface of the plurality of polishing features;
• the plurality of polishing features have a first height and the one or more base features have a second height, wherein the first height is greater than the second height;
• and
• the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;
• and
• a radio frequency (RFID) tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface.