Integrated circuit package and method of manufacturing the same

A method of making an integrated circuit package, comprising the steps of

• a) providing a plurality of die members connected to respective electrical contact members in a mould;
• b) providing a mould insert in contact with at least a part of a first upper surface of a first die member;
• c) encasing the plurality of die members and the respective electrical contact members into a package collection body;
• and
• d) cutting the package collection body into at least two separate integrated circuit packages along a first cutting line extending through the package collection body and separating the plurality of die members, wherein the mould insert as provided in step b) extends across a part of the first cutting line, thereby forming a side opening in a side surface of each of the at lease two separate integrated circuit packages.