Stack frame for electrical connections and the method to fabricate thereof

A package structure, comprising:

• a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap;
• a first insulating layer, disposed over a top surface of the plurality of metal parts and a top surface of a conductive element, said first insulating layer extending into said gap;
• and
• a first bond, disposed in the first insulating layer, wherein the first bond is electrically connected to a first terminal of the conductive element and has a top surface being exposed from a top surface of the first insulating layer for electrically connecting with a first metal part of the plurality of metal parts through a conductive pattern that is disposed in a via of the first insulating layer.

A method to package a conductive element, said method comprising:

• forming a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap;
• forming a first insulating layer over a top surface of the plurality of metal parts and a top surface of a conductive element, said first insulating layer extending into said gap;
• and
• forming a first bond in the first insulating layer, wherein the first bond is electrically connected to a first terminal of the conductive element and a first metal part of the plurality of metal parts through a conductive pattern that is disposed in a via of the first insulating layer.