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US 10,593,538 B2Granted
Surface treatment methods and compositions therefor
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsWilliam A. Wojtczak, Keeyoung Park, Atsushi Mizutani
Life of this patent
Estimating the term…
Abstract
The disclosure provides methods and compositions therefor for treating a surface wherein a surface treatment layer is formed on the surface, thereby minimizing or preventing pattern collapse as the surface is subjected to typical cleaning steps in the semiconductor manufacturing process.
Claims64
A method for treating a semiconductor substrate having a pattern disposed on a surface of the substrate, comprising:
- contacting the surface with a surface treatment composition, wherein the surface treatment composition comprises at least one aprotic solvent and at least one surface treatment agent, the at least one surface treatment agent comprises a Si-containing compound, and the surface treatment composition forms a surface treatment layer on the surface such that the surface has a water contact angle of at least about 50 degrees;
- wherein the pattern comprises a feature having a dimension of at most about 20 nm.
A surface treatment composition, comprising:
- at least one aprotic solvent, and
- at least one surface treatment agent, the surface treatment agent being a Si-containing compound comprising a trimethylsilyl group, an aminosilyl group, or a disilazane group, provided that the disilazane group comprises no Si—H bond,
- wherein the surface treatment composition forms a surface treatment layer on a surface such that the surface has a water contact angle of at least about 50 degrees, and the surface has a pattern comprising a feature having a dimension of at most about 20 nm.
A surface treatment composition, comprising:
- from about 90 wt % to about 99.5 wt % at least one aprotic solvent selected from the group consisting of lactones, ketones, aromatic hydrocarbons, siloxanes, glycol dialkyl ethers, glycol alkyl ether acetates, esters, ureas, lactams, dimethyl sulfoxide, and N-methyl pyrrolidone, and
- from about 0.5 wt % to about 10 wt % at least one surface treatment agent, the surface treatment agent is a Si-containing compound comprising a trimethylsilyl group, an aminosilyl group, or a disilazane group, provided that the disilazane group comprises no Si—H bond;
- wherein the surface treatment composition forms a surface treatment layer on a surface such that the surface has a water contact angle of at least about 50 degrees, and the surface has a pattern comprising a feature having a dimension of at most about 20 nm.
A surface treatment composition, consisting of:
- at least one aprotic solvent, and
- at least one surface treatment agent, the surface treatment agent being a Si-containing compound comprising a trimethylsilyl group, an aminosilyl group, or a disilazane group, provided that the disilazane group comprises no Si-H bond.
Dependencies are inferred from the claim text.