Longitudinal silicon ingot slicing machine and jig fixture

Abstract

The present subject matter discloses a method of lateral slicing of cylindrical silicon ingot to maximize resulting chips yield as compared to the conventional transverse slicing of ingot. The resulting rectangular wafers made from lateral slicing of ingot maximizes yield as by the lateral slicing of ingot, overall chips per wafer ratio gets increased as compared to transversal cutting while the said method decreases waste due to conflict between chip and wafer geometry. The novel apparatus or system of present method includes JIG having plurality of parallel bars. The JIG is provided to covers and holds the ingot during slicing while the parallel bars of JIG between which diamond dust embedded wires gets located and which behaves as a guide for diamond embedded wires during the slicing of ingot. Also, this JIG mechanism protects and holds the wires from sliding down and miss the designated location of slicing during the process as the slicing of cylindrical ingot is being done longitudinally. Further, the parallel bars of the JIG mechanism are made such a way that the slurry and debris from the slicing automatically gets released.

Dependencies are inferred from the claim text.