Multilayer ceramic structure
AssigneeKemet Electronics Corporation
InventorJohn Bultitude
Life of this patent
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Abstract
An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.
Claims40
A method for forming a multilayered ceramic capacitor comprising:
- forming a layered arrangement comprising at least one layered sequence comprising a first internal electrode precursor layer, a ceramic precursor layer, a second internal electrode precursor layer and another said ceramic precursor layer wherein at least two said ceramic precursor layers include a closed void precursor layer;
- heating said layered arrangement to form a capacitor wherein:
- said first internal electrode precursor layer forms a first internal electrode;
- said second internal electrode precursor layer forms a second internal electrode;
- each said ceramic precursor layer forms dielectric;
- and
- each said closed void precursor layer forms a first closed void layer comprising at least one closed void;
- forming a first external termination on said capacitor wherein said first external termination is in electrical contact with said first internal electrodes;
- and
- forming a second external termination on said capacitor wherein said second external termination is in electrical contact with said second internal electrodes.
A method for forming a multilayered ceramic capacitor comprising:
- forming a layered arrangement comprising at least one layered sequence comprising a first internal electrode precursor layer, a ceramic precursor layer, a second internal electrode precursor layer and another said ceramic precursor layer wherein at least one said ceramic precursor layer includes a closed void precursor layer wherein each said ceramic precursor layer has a thickness of 0.5 μm up to 50 μm;
- heating said layered arrangement to form a capacitor wherein:
- said first internal electrode precursor layer forms a first internal electrode;
- said second internal electrode precursor layer forms a second internal electrode;
- each said ceramic precursor layer forms dielectric;
- and
- said closed void precursor layer forms a first closed void layer comprising at least one closed void;
- forming a first external termination on said capacitor wherein said first external termination is in electrical contact with said first internal electrodes;
- and
- forming a second external termination on said capacitor wherein said second external termination is in electrical contact with said second internal electrodes.
Dependencies are inferred from the claim text.