Packaged electronic module and manufacturing method thereof
OwnerCyril Lalo, Sebastien Pochic +1inventors
InventorsCyril Lalo, Sebastien Pochic, Jacques Essebag
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Abstract
The present invention is a packaged electronic module with embedded electronics for use in smart cards. This invention assembles a plurality of electronics components on a flexible printed circuit, together with an integrated circuit chip and a contact plate, into a module. This module can then be embedded into a plastic card, using regular milling techniques, by a card manufacturer. This method packages the plurality of electronics components into a module. The present invention provides a business with the capability to avoid additional capital expenditure required for special equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.
Claims17
An electronic module for use with a card, comprising:
- at least one integrated circuit chip;
- a contact plate configured with the at least one integrated circuit chip;
- a plurality of electronic components connected to the at least one integrated circuit chip;
- and
- at least one electronic display connected to the plurality of electronics components and/or the at least one integrated circuit chip;
- wherein the electronic module is configured with the card, and at least a portion of the contact plate and at least a portion of the at least one electronic display are visible on a first surface of the card;
- and
- wherein a first portion of the electronic module is embedded into the first surface of the card from the front of the first surface, and a second portion of the electronic module is embedded into the first surface of the card separately from the first portion and from the front of the first surface, and the portions are connected to form a value-add smart card.
An electronic module for use with a card, comprising:
- at least one integrated circuit chip;
- a plurality of electronic components connected to the at least one integrated circuit chip;
- and
- at least one electronic display connected to the plurality of electronics components and/or the at least one integrated circuit chip;
- wherein a first portion of the electronic module is embedded into a first surface of the card from the front of the first surface, and a second portion of the electronic module is embedded into the first surface of the card separately from the first portion and from the front of the first surface, and the portions are connected to form a value-add smart card.
A method of assembling an electronic module within a card, the method comprising:
- (A) providing a card;
- (B) creating an open area in a first surface of the card;
- (C) embedding a first portion of the electronic module into a first portion of the open area;
- and
- (D) embedding a second portion of the electronic module into a second portion of the open area;
- wherein the first portion of the electronic module and the second portion of the electronic module are electrically connected together by the embedding of the first portion of the electronic module and the second portion of the electronic module into the open area.
Dependencies are inferred from the claim text.