Apparatus, system, and method for improved heat spreading in heatsinks

A computing device comprising:

• a plurality of individual power components that:
• are soldered to a circuit board;
• and
• dissipate heat within the computing device;
• a heatsink assembly that comprises a plurality of vapor chambers that:
• are mounted to the plurality of individual power components, wherein each vapor chamber within the plurality of vapor chambers is mounted to a top side of a different individual power component within the plurality of individual power components;
• and
• absorb heat dissipated by the plurality of individual power components within the computing device;
• and at least one thermal coupling that:
• physically bridges the plurality of vapor chambers to one another within the computing device;
• and
• facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components;
• and
• wherein the at least one thermal coupling comprises a plurality of U-shaped heat pipes that are each attached to the plurality of vapor chambers and each thermally couple the plurality of vapor chambers to one another.

A method comprising:

• mounting a plurality of vapor chambers to a plurality of individual power components that:
• are soldered to a circuit board;
• and
• dissipate heat within a computing device;
• wherein each vapor chamber within the plurality of vapor chambers is mounted to a top side of a different individual power component within the plurality of individual power components;
• installing, to the plurality of vapor chambers, at least one thermal coupling that:
• physically bridges the plurality of vapor chambers to one another within the computing device;
• and
• facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components;
• wherein the at least one thermal coupling comprises a plurality of U-shaped heat pipes that are each attached to the plurality of vapor chambers and each thermally couple the plurality of vapor chambers to one another;
• absorbing, via the plurality of vapor chambers, heat dissipated by the plurality of individual power components within the computing device;
• and
• spreading the absorbed heat among the plurality of vapor chambers by way of the thermal coupling.