Substrate processing apparatus and substrate processing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsMasahiko Harumoto, Masaya Asai, Yuji Tanaka, Koji Kaneyama
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AssigneeSCREEN Holdings Co., Ltd.
InventorsMasahiko Harumoto, Masaya Asai, Yuji Tanaka, Koji Kaneyama
Estimating the term…
A resist film including a metallic component and a photosensitive material is formed on a surface of a substrate, and then a peripheral portion of the resist film on the substrate is irradiated with light by an edge exposer. Subsequently, development processing is performed with a development liquid from a nozzle on the exposed portion of the resist film. Thus, the part of the resist film formed on the peripheral portion of the substrate is removed. Thereafter, exposure processing is performed on the substrate in an exposure device, so that an exposure pattern is formed on the resist film. Then, a development liquid is supplied to the exposed substrate in a development processing unit, so that development processing is performed on the resist film.
A substrate processing apparatus arranged to be adjacent to an exposure device that performs exposure processing on a substrate, comprising:
A substrate processing method comprising:
Dependencies are inferred from the claim text.