Connector, display screen and method for manufacturing the display screen

A method for manufacturing a display screen, comprising the following steps:

• forming a connector by arranging, on a substrate, a conductor structure whose target surface away from the substrate is uneven;
• connecting one end of the conductor structure to a data signal line on a display panel;
• connecting the other end of the conductor structure to a driver IC;
• and
• bending the connector to arrange the driver IC on a non-display side of the display panel,
• wherein the display panel comprises:
• a substrate base, and an active layer, a first gate insulating layer, a first gate signal line, a second gate insulating layer, a second gate signal line, an interlayer dielectric layer and a data signal line which are arranged on the substrate base in sequence,
• wherein the forming of the connector by arranging, on the substrate, the conductor structure whose target surface away from the substrate is uneven comprises:
• forming two conductor layers and two target insulating layers on the substrate, the two target insulating layers being stacked between the two conductor layers, wherein the first conductor layer close to the substrate is formed of the same material layer as that of the first gate signal line;
• the first target insulating layer close to the substrate is formed of the same material layer as that of the second gate insulating layer;
• the second target insulating layer close to the substrate is formed of the same material layer as that of the interlayer dielectric layer;
• the second conductor layer close to the substrate is formed of the same material layer as that of the data signal line;
• the step of connecting one end of the conductor structure to the data signal line on the display panel comprises:
• connecting the second conductor layer close to the substrate to the data signal line;
• the step of connecting the other end of the conductor structure to the driver IC comprises:
• connecting any one of the two conductor layers to the driver IC.