Reflow-compatible optical I/O assembly adapter

A system, comprising:

• at least one processor;
• and
• at least one memory coupled to the at least one processor;
• wherein the system includes optoelectronic components, including an optoelectronic connector, comprising:
• a wafer-level packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate;
• and
• an assembly adapter enclosing the POeM;
• wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule enclosing at least one optical fiber during assembly of the apparatus;
• wherein the assembly adapter is comprised of a solder-reflow-compatible material to facilitate bonding the assembly adapter to a circuit board;
• and
• a clamp that secures the MT ferrule in the MT ferrule cavity, wherein the clamp is applied between the MT ferrule and assembly adapter such that clamping force will be mainly applied between the MT ferrule, the assembly adapter and a protruding part of the optical connector, wherein the clamp mechanically protects the optical connector and the SiP chip.

A method for assembling an optical-connector assembly that connects one or more optical fibers to an optoelectronic system, comprising:

• forming a wafer-level packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate;
• face-down aligning and bonding an optical connector to a SiP chip to form a connector/SiP coupling;
• face-down bonding an assembly adapter to the optical connector, wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule containing at least one optical fiber, during insertion of the MT ferrule into the MT ferrule cavity;
• inserting a dust cap into the MT ferrule cavity, wherein the dust cap has the same dimensions as the MT ferrule;
• using a clamp to clamp together components of the optical-connector assembly;
• and
• performing a solder-reflow operation to solder the assembly adapter to a circuit board;
• and
• wherein the clamp secures the MT ferrule in the MT ferrule cavity, wherein the clamp is applied between the MT ferrule and assembly adapter such that clamping force is mainly applied between the MT ferrule, the assembly adapter and a protruding part of the optical connector, wherein the clamp mechanically protects the optical connector and the SiP chip.