Spectral imaging detector

A two-dimensional detector array, comprising:

• a plurality of slice modules, wherein each slice module respectively includes a length parallel to a z-axis, a width parallel to an x-axis, and a depth parallel to a y-axis, and each slice module further includes:
• a surface defined by the length and the width of a corresponding slice module, wherein each surface of the plurality of slice modules is adjacent to another surface of another slice module;
• a support structure;
• and
• a plurality of one-dimensional multi-element photo detectors, wherein each one-dimensional multi-element photo detector respectively includes a length parallel to the z-axis, a width parallel to the x-axis and a depth parallel to the y-axis, a first end, and a second end opposing the first end, wherein the length parallel to the z-axis is between the first end and the second end and wherein the first end of a one-dimensional multi-element photo detector of a slice module is abutted to the second end of another one-dimensional multi-element photo detector of the same slice module and is affixed to the support structure, wherein each one-dimensional multi-element photo detector further includes:
• a photodiode substrate, including:
• a photodiode array with a photosensitive area, including:
• a first upper row of photodiode pixels;
• and
• a second lower row of photodiode pixels, wherein the photodiode array includes:
• an extended area with a non-photosensitive area with readout electronics incorporated in the non-photosensitive area, wherein electrical traces interconnect the first and second rows of photodiode pixels and the readout electronics;
• and
• a scintillator array, including a first upper row and a second lower row of scintillator pixels, wherein the first upper and second lower rows of scintillator pixels are respectively optically coupled to the first upper and second lower rows of photodiode pixels.