Test apparatus for semiconductor device and method of manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsJoo-sung Yun, Soon-il Kwon, Byeong-min Yu
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AssigneeSamsung Electronics Co., Ltd.
InventorsJoo-sung Yun, Soon-il Kwon, Byeong-min Yu
Estimating the term…
Provided are a test board and a test system for efficiently testing a semiconductor package, and a manufacturing method for the semiconductor package using the same. A test apparatus includes a field programmable gate array (FPGA) configured to output a first data signal to be transmitted to the semiconductor device and a second data signal to be transmitted to the semiconductor device and a memory configured to store a test result. The FPGA includes a first input/output block configured to output the first data signal, a second input/output block configured to output the second data signal, a serializer/deserializer (SerDes) circuit configured to generate a strobe signal, and a skew calibration input/output block configured to receive the first data signal from the first input/output block, the second data signal from the second input/output block, and the strobe signal from the SerDes circuit.
A test apparatus for a semiconductor device, the test apparatus comprising:
A test apparatus for a semiconductor device, the test apparatus comprising:
A method of manufacturing a semiconductor device using a test apparatus that includes a field programmable gate array (FPGA), the method comprising:
Dependencies are inferred from the claim text.