Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
AssigneeASML Netherlands B.V.
InventorsHenricus Petrus Maria Pellemans, Arie Jeffrey Den Boef
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Abstract
A device manufacturing method is disclosed. A radiated spot is directed onto a target pattern formed on a substrate. The radiated spot is moved along the target pattern in a series of discrete steps, each discrete step corresponding to respective positions of the radiated spot on the target pattern. Measurement signals are generated that correspond to respective ones of the positions of the radiated spot on the target pattern. A single value is determined that is based on the measurement signals and that is representative of the property of the substrate.
Claims14
A scatterometer configured to measure a property of a target on a substrate, the scatterometer comprising:
- a radiation source configured to produce a radiated spot on the target, wherein a position of the radiated spot is adjusted in discrete steps along a length of the target;
- a detector configured to receive radiation scattered by the target, the received radiation being associated with positions of the radiation spot on the target that correspond to the discrete steps, and to generate measurement signals based on the positions of the radiated spot on the target;
- and
- a processor configured to output, based on the measurement signals, a single value that is representative of the property of the target.
Dependencies are inferred from the claim text.