US 10,590,916 B2 · Multisiphon passive cooling system

Abstract

A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.

Claims20

Dependent claims

A passive cooling system comprising:

a first conduit configured to be thermally connected to one or more heat generating components located within an enclosure, the first conduit fluidly connected to a distribution manifold and a condensing unit, the condensing unit positioned external to the enclosure and above the one or more heat generating components, the distribution manifold positioned below the heat generating components;
a second conduit fluidly connected to the condensing unit and the distribution manifold so as to establish a closed loop comprising the first conduit, the condensing unit, the distribution manifold, and the second conduit, the closed loop being absent of a pump;
and
a cooling medium contained within the closed loop and circulating through the closed loop via convection.

1 more element

Dependencies are inferred from the claim text.

Multisiphon passive cooling system

Life of this patent

Multisiphon passive cooling system

Life of this patent

Abstract

Claims20