Copper electroplating baths containing compounds of reaction products of amines and quinones
AssigneeRohm and Haas Electronic Materials LLC
InventorsWeijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
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Abstract
A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
Claims9
An electroplating bath comprising one or more sources of copper ions, one or more accelerators, one or more suppressors, one or more electrolytes and one or more compounds comprising a reaction product of an amine and a quinone wherein the amine has a formula:
- where R′ is hydrogen;
- and R comprises H2N(CH2)m—, HO—(CH2)m—, Q-(CH2)m—, a moiety having a structure:
- a moiety having a structure:
- or
- a moiety having a structure:
- where R1-R14 are independently chosen from hydrogen and (C1-C3)alkyl;
- m is an integer from 2-12, n is an integer from 2-10, p is an integer from 1-10, q is an integer from 2-10 and r, s and t are numbers from 1 to 10;
- and Q is a 5-6 membered heterocyclic ring having one or two nitrogen atoms in the ring or Q is a benzene sulfonamide moiety.
Dependencies are inferred from the claim text.