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US 10,590,320 B2Granted
Adhesive molecules
AssigneesThe Chugoku Electric Power Co., Inc., Sessile Research Corporation
InventorsTsukasa Yoshizaki, Keiji Yamashita, Kyoko Kamiya, Kohichi Suzuki, Yoshio Hayashi
Life of this patent
Estimating the term…
Abstract
To provide novel adhesive molecules. An adhesive molecule having an amino acid sequence of SEQ ID NO. 1, or an amino acid sequence including a conservative substitution, a deletion, an insertion and/or a modification in the sequence of SEQ ID NO. 1.
Claims13
An adhesive molecule comprising the amino acid sequence of SEQ ID NO:
- 1, or the amino acid sequence of SEQ ID NO:
- 1 wherein at least one tyrosine is modified to dihydroxyphenylalanine.
Dependencies are inferred from the claim text.