High performance, thermally conductive surface mount (die attach) adhesives

A composition comprising:

• (a) a thermally conductive silver component selected from the group consisting of (i) 0.5 to 85 wt % of silver nano-particles having a particle diameter of 5 to 500 nanometers, (ii) 0.5 to 86 wt % of silver particles having a diameter of about 0.5 to 50 micrometers and (iii) 60 to 85 wt % of a combination of said silver nano-particles and said silver particles;
• (b) a polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane, and (iii) 0.5 to 12 wt % of a combination of the polyorganosilsesquioxane fine powder and the copolymer powder;
• (c) 0.5 to 14 wt % of a resin selected from the group consisting of (i) a thermosetting resin component comprising a thermosetting resin, (ii) a thermoplastic resin and (iii) a combination of the thermosetting resin component and the thermoplastic resin;
• and
• (d) 3 to 12 wt % of a total solvent content in (i) one or more solvents or (ii) a vehicle containing one or more solvents.