Resin composition for display substrate, and heat-resistant resin film, organic EL display substrate, and method for manufacturing organic EL display using same
AssigneeToray Industries, Inc.
InventorsTomoki Ashibe, Daichi Miyazaki, Koji Ueoka, Akinori Saeki, Masahito Nishiyama
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Abstract
A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.
Claims7
A resin composition for a display substrate comprising a heat resistant resin or a precursor thereof and a solvent, the solvent containing, as primary component, an amide compound with a surface tension of 35 mN/m or less at 25° C., wherein the heat resistant resin or precursor thereof contains a repeating unit as represented by chemical formula (3) as primary component and 50 to 95 mol % of the R4 or R5 groups contained in the resin is accounted for by hydrocarbon groups containing 1 to 10 carbon atoms:
- wherein C in chemical formula (3) denotes a tetravalent tetracarboxylic acid residue containing 2 or more carbon atoms;
- D denotes a divalent diamine residue containing 2 or more carbon atoms;
- and R4 and R5 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
Dependencies are inferred from the claim text.