Polyimide dry film and application thereof

A method for applying a dry film onto a substrate by wet lamination, wherein

• (a) the dry film comprises a carrier and a polyimide layer, the polyimide layer comprises (i) a polyimide precursor or soluble polyimide and (ii) a solvent, and the solvent comprises a hydrophilic solvent and a hydrophobic solvent with a weight ratio of the hydrophilic solvent to the hydrophobic solvent being in a range of about 0.05 to about 2, wherein the polyimide layer further comprises an additive and the additive comprises a stabilizer, a ring closing promoter, a pigment, a leveling agent, a deforming agent, a coupling agent, a catalyst, an acrylate monomer, a photoinitiator or a combination thereof;
• and
• (b) the method comprises the step of laminating the dry film onto the substrate with the polyimide layer facing the substrate to form a laminate wherein the stabilizer comprises
• or a combination thereof
• wherein
• R17″, R18″, R19″, and R20″ each independently represent H, C1-C4 alkyl or C6-C14 aryl, or R19″ and R20″, together with the oxygen atoms to which they are attached, form a 5 to 6-membered heterocyclic ring, or R19″ and R17″ or R20″ and R18″, together with the oxygen atom and nitrogen atom to which they are attached, form a 5 to 6-membered heterocyclic ring, or R17″ and R18″, together with the nitrogen atom to which they are attached, form a 5 to 6-membered heterocyclic ring;
• R21″ and R22″ each independently represent C1-C4 alkyl, or R21″ and R22″, together with the carbon atom to which they are attached, form a 5 to 6-membered carbocyclic ring;
• and
• R23″ and R24″ each independently represent C1-C4 alkyl.