Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same

A thermosetting resin composition for high frequency, the composition comprising:

• (a) a poly(phenylene ether) having two or more unsaturated substituent groups selected from the group consisting of a vinyl group and an allyl group at both ends of the molecular chain thereof, or an oligomer of the poly(phenylene ether);
• (b) three or more different cross-linking curing agents;
• and
• (c) a flame retardant,
• wherein the cross-linking curing agent (b) includes a mixture of a hydrocarbon-based cross-linking agent having a molecular weight (Mw) in a range of 500 to 3,000 (b1), a cross-linking agent containing three or more functional groups (b2) and a cross-linking agent being a rubber having a block structure (b3),
• the poly(phenylene ether) resin (a) is represented by the following Formula 1:
• in Formula 1,
• Y is one or more compounds selected from the group consisting of bisphenol A-type, bisphenol F, bisphenol S, naphthalene, anthracene, biphenyl, tetramethyl biphenyl, phenol novolac, cresol novolac, bisphenol A novolac, and bisphenol S novolac compounds, and
• m and n are each independently a natural number from 3 to 20.