Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYuki Kitai, Hiroaki Fujiwara, Hirosuke Saito
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Abstract
A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.
Claims13
A polyphenylene ether resin composition comprising (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond,
- wherein the crosslinking agent serving as component (B) includes (B-1) divinylbenzene and (B-2) polybutadiene, and the total amount thereof is from 50 to 100 mass %,
- components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5, and
- components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1;
- and
- the substituent at the end of the modified polyphenylene ether (A) includes a substituent selected from Formula 2 or Formula 3:
Dependencies are inferred from the claim text.