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US 10,589,992 B2Granted
Micro-electro-mechanical system (MEMS) structures and design structures
AssigneeInternational Business Machines Corporation
InventorsMichael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
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Abstract
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
Claims11
A method of forming a Micro-Electro-Mechanical System (MEMS) beam structure comprising:
- forming both tungsten material and semiconductor material above and below a MEMS beam, wherein the MEMS beam is formed between a substrate and a lid;
- and
- etching both the tungsten material and the semiconductor material at least above and below the MEMS beam, using an XeF2 etchant,
- wherein the etching is performed by venting both the tungsten material and the semiconductor material above and below the MEMS beam, using a vent hole in the lid, to form an upper cavity structure above the MEMS beam and a lower cavity structure below the MEMS beam, and
- wherein the MEMS beam comprises a cantilevered beam structure comprised of a first cantilevered beam and a second cantilevered beam separated from one another by a via which connects the upper cavity structure and the lower cavity structure to one another.
2 more elements
Dependencies are inferred from the claim text.