System and method for a MEMS transducer

A microelectromechanical system (MEMS) comprising:

• a first MEMS transducer element disposed at a top surface of a first semiconductor substrate overlying a first cavity within the first semiconductor substrate;
• a second MEMS transducer element disposed at a top surface of a second semiconductor substrate overlying a second cavity within the second semiconductor substrate;
• a third substrate comprising a shared cavity extending through an entire thickness of the third substrate, wherein the first semiconductor substrate and the second semiconductor substrate are disposed on the third substrate, at least a portion of the first cavity and a portion of the second cavity overly the shared cavity, and the third substrate is different from the first semiconductor substrate and the second semiconductor substrate;
• and
• a fourth substrate comprising a sound port having an opening spaced equidistant from the first MEMS transducer element and the second MEMS transducer element, wherein the third substrate is disposed on the fourth substrate, at least a portion of the shared cavity overlies the sound port, and the fourth substrate comprises a material different from the first semiconductor substrate, the second semiconductor substrate and the third substrate,
• wherein the first semiconductor substrate and the second semiconductor substrate are a same substrate, and wherein a first end of the first MEMS transducer element is directly supported by a first semiconductor substrate portion of the same substrate having a first thickness, wherein a second end of the first MEMS transducer element and a first end of the second MEMS transducer element are directly supported by a second semiconductor substrate portion of the same substrate having a second thickness less than the first thickness, and wherein a second end of the second MEMS transducer element is directly supported by a third semiconductor substrate portion of the same substrate having the first thickness.