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US 10,589,457 B2Granted
Embossing compound for embossing lithography
AssigneeEV Group E. Thallner GmbH
InventorMustapha Chouiki
Life of this patent
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Abstract
An embossing material that can be hardened and used for embossing lithography, comprised of a mixture of at least one polymerizable main component, and at least one secondary component. The invention also relates to a use of the embossing material for the primary forming of an embossing form.
Claims7
An embossing system for embossing a substrate to form an embossed material thereon, said embossing system comprising:
- an embossing material to be embossed onto the substrate, the embossing material comprising:
- one or more polymerizable main inorganic components based on silicon oxide and selected from the group consisting of polyhedral oligomeric silsesquioxane (POSS), polydimethylsiloxane (PDMS), and tetraethylorthosilicate (TEOS);
- and
- one or more secondary components selected from the group consisting of acrylics, epoxides, epoxy resins, phenols, alkanes, alkenes, alkynes, and benzenes;
- and
- an embossing die configured to emboss the embossing material onto the substrate;
- wherein a proportion by weight of the polymerizable main inorganic components in the embossing material is greater than a proportion by weight of the secondary components in the embossing material,
- wherein adhesion between the embossed material and the embossing die is less than 2.5 J/m2,
- wherein, when the embossing material is hydrophilic, the embossing die is hydrophobic,
- wherein, when the embossing material is hydrophobic, the embossing die is hydrophilic,
- wherein the embossing material consists of the one or more polymerizable main inorganic components, the secondary components, a solvent, and an activated initiator, and
- wherein the secondary components are not copolymerizable with the polymerizable main inorganic components.
9 more elements
A method of embossing an embossing material onto a substrate with an embossing die to form an embossed material thereon, the method comprising:
- coating the substrate with an embossing material consisting of one or more polymerizable main inorganic components based on silicon oxide, one or more secondary components, a solvent, and an initiator;
- applying the embossing die to the embossing material to mold the embossing material;
- curing only the polymerizable main inorganic components of the embossing material on the substrate during the application of the embossing die to the embossing material to form the embossed material on the substrate;
- and
- demolding the embossing die from the embossed material after the curing,
- wherein the one or more polymerizable main inorganic components are selected from the group consisting of polyhedral oligomeric silsesquioxane (POSS), polydimethylsiloxane (PDMS), and tetraethylorthosilicate (TEOS);
- and
- wherein the one or more secondary components are selected from the group consisting of acrylics, epoxides, epoxy resins, phenols, alkanes, alkenes, alkynes, and benzenes;
- wherein a proportion by weight of the main inorganic components in the embossing material is greater than a proportion by weight of the secondary components in the embossing material,
- wherein adhesion between the embossed material and the embossing die is less than 2.5 J/m2,
- wherein, when the embossing material is hydrophilic, the embossing die is hydrophobic, and
- wherein, when the embossing material is hydrophobic, the embossing die is hydrophilic.
9 more elements
An embossing system for embossing a substrate to form an embossed material thereon, said embossing system comprising:
- a hydrophobic embossing material to be embossed onto the substrate, the embossing material comprising:
- one or more polymerizable main inorganic components based on silicon oxide and selected from the group consisting of polyhedral oligomeric silsesquioxane (POSS), polydimethylsiloxane (PDMS), and tetraethylorthosilicate (TEOS);
- and
- one or more secondary components selected from the group consisting of acrylics, epoxides, epoxy resins, phenols, alkanes, alkenes, alkynes, and benzenes;
- and
- a hydrophobic embossing die configured to emboss the embossing material onto the substrate,
- wherein a proportion by weight of the main inorganic components in the embossing material is greater than a proportion by weight of the secondary components in the embossing material,
- wherein adhesion between the embossed material and the embossing die is less than 2.5 J/m2, and
- wherein the secondary components are not copolymerizable with the polymerizable main inorganic components.
6 more elements
Dependencies are inferred from the claim text.