Wire saw apparatus

A wire saw apparatus comprising:

• a wire row formed of a wire that is wound around a plurality of wire guides and reciprocatively travels in an axial direction of the wire;
• a nozzle from which a coolant or slurry is supplied to the wire;
• and
• a workpiece feed mechanism that presses a held workpiece against the wire row, the wire saw apparatus being configured to slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece feed mechanism against the wire row and feeding it for slicing while supplying the coolant or the slurry from the nozzle to the wire,
• wherein the nozzle is arranged above the wire row to be orthogonal to the wire row, and windbreak plates are arranged on both left and right sides of the arranged nozzle seen from an axial direction of the nozzle,
• each windbreak plate is arranged in such a manner that a distance between a lower surface of the windbreak plate and the wire row is 1 mm or more and 10 mm or less,
• the nozzle comprises an opening through which the coolant or slurry is supplied to the wire, wherein the opening of the nozzle faces the wire of the wire row, which causes the coolant or the slurry to flow downward from the nozzle to the wire, and
• wherein the lower surface of the windbreak plate is closer to the wire than the opening of the nozzle.