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US 10,589,305 B2Granted
Substrate treating apparatus, and method of controlling the substrate treating apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorYasuo Takahashi
Life of this patent
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AssigneeSCREEN Holdings Co., Ltd.
InventorYasuo Takahashi
Estimating the term…
In a coating apparatus, a nozzle moving mechanism selectively grips any one of a plurality of coating solution nozzles, moves the gripped coating solution nozzle and a solvent nozzle together, and moves at least the solvent nozzle to a solvent suction unit. The moved solvent nozzle is caused to dispense a solvent to the solvent suction unit, and the gripped coating solution nozzle is caused to suck the solvent retained in the same solvent suction unit to which the solvent has been dispensed. Thus, since dispensation and suction of the solvent are done in the same solvent suction unit, the quantity of the solvent used can be held down. Further, a supply line for supplying the solvent does not need to be provided for the suction unit. The construction of the suction unit can therefore be made simple, and its cost can be held down.
A substrate treating apparatus comprising:
A method of controlling a substrate treating apparatus having a plurality of first nozzles for dispensing a first treating liquid to substrates, and a second nozzle for dispensing a second treating liquid to the substrates, the method comprising:
Dependencies are inferred from the claim text.