Photosensitive polyimide resin composition and method of manufacturing cover film using the same

A method for manufacturing a cover film comprising coating a photosensitive polyimide resin composition on a substrate and drying the photosensitive polyimide resin to obtain the cover film, wherein the photosensitive polyimide resin composition comprises:

• (a) a dye or a pigment serving as an infrared absorber, accounting for 5-40% of the solid weight of the photosensitive polyimide resin composition;
• (b) an epoxy compound accounting for 5-40% of the solid weight of the photosensitive polyimide resin composition;
• (c) a photosensitive polyimide having a structure of formula (1):
• wherein m and n are independently 1 to 600;
• X is a tetravalent organic group, a main chain of which contains an alicyclic group;
• Y is a divalent organic group, a main chain of which contains a siloxane group;
• Z is a divalent organic group, a side chain of which at least contains a phenolic group or a carboxyl group;
• and the photosensitive polyimide accounts for 30-90% of the solid weight of the photosensitive polyimide resin composition;
• and
• (d) a photo initiator accounting for 0.1-15% of the solid weight of the photosensitive polyimide resin composition, wherein the epoxy compound is neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, bisphenol A diglycidyl ether, 1,2-propanediol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerol tripropoxy triglycidyl ether, m-benzenediol diglycidyl ether, or a combination thereof.