Overforce control through sense die design
AssigneeHoneywell International Inc.
InventorsRichard Wade, Richard Alan Davis
Life of this patent
Estimating the term…
Abstract
A sense die comprises a chip comprising a sense diaphragm, one or more sense elements supported by the diaphragm, one or more bond pads supported by a first side of the chip, a structural frame disposed on the first side of the chip, and one or more electrical contacts extending through the structural frame. Each of the one or more bond pads is electrically coupled to at least one of the one or more sense elements. The structural frame is disposed at least partially about the diaphragm, and the one or more electrical contacts are electrically coupled to the one or more bond pads.
Claims13
A sense die comprising:
- a chip comprising a sense diaphragm;
- one or more sense elements supported by the diaphragm;
- one or more bond pads supported by a first side of the chip, each of the one or more bond pads electrically coupled to at least one of the one or more sense elements;
- a structural frame disposed on the first side of the chip, wherein the structural frame is disposed at least partially about the diaphragm;
- and
- one or more electrical contacts extending through the structural frame, wherein the one or more electrical contacts are electrically coupled to the one or more bond pads.
A sense die comprising:
- a chip comprising a diaphragm, wherein the chip comprises a first side and a second side;
- a structural frame disposed on the first side of the chip, wherein the structural frame is disposed at least partially about the diaphragm;
- and
- a substrate, wherein the chip is coupled to the substrate,
- wherein the structural frame is in contact with a surface of the substrate,
- wherein the structural frame is disposed between the first side of the chip and the surface of the substrate, and
- wherein a height between a surface of the diaphragm on the first side of the chip and a surface of the substrate facing the diaphragm is determined by a height of the structural frame.
Dependencies are inferred from the claim text.