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US 10,570,321 B2Granted
Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
AssigneeLG Chem, Ltd.
InventorsYoon Gyung Cho, Kyung Yul Bae, Hyun Jee Yoo
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Abstract
Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
Claims14
A pressure-sensitive adhesive film satisfying Equation 1, comprising:
- a pressure-sensitive adhesive having a water vapor transmission rate of 50 g/m2·day or less in a thickness direction, wherein the water vapor transmission rate is measured according to a specification of ASTM F1249:
- ΔX≤0.3 mm, [Equation 1]
- wherein ΔX is a change in a creeping distance of a pressure-sensitive adhesive layer between 50 to 200 seconds when a base film, in which the pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive is formed to have a thickness of 50 μm on one surface thereof, is adhered to a glass plate having an adhesive area of 1 cm2, and aged for 24 hours, and then an 1 kg load is applied thereto at 80° C. for 1000 seconds, and
- wherein the pressure-sensitive adhesive film has a loss factor (tan δ) of 0.05 to 0.25 at 80° C. and a frequency of 1 Hz.
1 more element
Dependencies are inferred from the claim text.