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US 10,570,257 B2Granted
Copolymerized high temperature bonding component
AssigneeApplied Materials, Inc.
InventorsJennifer Y. Sun, Sumanth Banda
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Abstract
A copolymerized high temperature bonding component that includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other to form a copolymer. The bonding component may have properties that allow it to be used for binding dissimilar materials.
Claims20
A bonding component comprising:
- a first amount of an organofluorine polymer;
- and
- a second amount of an organosilicon polymer,
- wherein the organofluorine polymer is chemically bound to the organosilicon polymer, wherein the organofluorine polymer and the organosilicon polymer are chemically bound as a copolymer.
1 more element
An article for a processing chamber, the article comprising:
- a first component;
- a second component;
- and
- a bonding layer between the first component and the second component, wherein the bonding layer bonds the first component to the second component, wherein the bonding layer comprises a copolymer comprising a first amount of an organofluorine polymer chemically bonded to a second amount of an organosilicon polymer.
1 more element
Dependencies are inferred from the claim text.