Electronic-component mounting apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorKohei Seyama
Life of this patent
Estimating the term…
Abstract
Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.
Claims2
An electronic-component mounting apparatus for mounting electronic components to a substrate, the apparatus comprising:
- a paste application block, configured to apply a non-conductive paste at positions on the substrate at which the electronic components are to be mounted;
- a first sectionalized mounting stage, configured to heat the substrate that has the non-conductive paste applied on, the first sectionalized mounting stage is divided into a heating section and a non-heating section, the heating section being for heating the substrate fixed to a front surface of the heating section, the non-heating section not heating the substrate suctioned to a front surface of the non-heating section, only a portion of the substrate that is fixed to the heating section of the first sectionalized mounting stage is heated, and the electronic components are mounted to the positions in the heated portion;
- and
- a second sectionalized mounting stage, configured to heat the substrate that has the non-conductive paste applied on, the second sectionalized mounting stage is divided into a second heating section and a second non-heating section invertedly arranged with respect to the first sectionalized mounting stage, only a portion of the substrate that is fixed to the heating section of the second sectionalized mounting stage is heated, and the electronic components are mounted to the positions in the heated portion.
Dependencies are inferred from the claim text.