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US 10,568,226 B2Granted
Electronic control device and method for manufacturing electronic control device
AssigneeHitachi Automotive Systems, Ltd.
InventorsSatoshi Arai, Yukio Sakigawa, Shigeharu Tsunoda, Masaru Kamoshida, Shirou Oouchi
Life of this patent
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Abstract
It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.
Claims8
An electronic control device, comprising:
- a resin molded body;
- a metal body;
- and
- an electronic component,
- wherein the resin molded body and a main surface of the metal body are bonded,
- wherein a housing space housing the electronic component is defined by the resin molded body and the metal body,
- wherein a stepped portion is provided in an outer peripheral portion of the metal body, the stepped portion having an outer side with a thin portion having a small thickness with respect to a thick portion of an inner side,
- wherein the main surface of the metal body is formed in the thin portion,
- wherein a side contact portion of the resin molded body has an outer side contact portion that contacts at least a part of a side surface of the thin portion, and an inner side contact portion that contacts at least a part of a side surface of the thick portion.
6 more elements
Dependencies are inferred from the claim text.