Method for producing multi-level metalization on a ceramic substrate
AssigneeCeramTec GmbH
InventorsSigurd Adler, Roland Dilsch, Alfred Thimm
Life of this patent
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Abstract
A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.
Claims11
A method for producing a multi-level metallization of copper on a ceramic substrate of AlN or Al2O3, wherein high-power areas having metallizations with greater current-carrying capacity and low-power areas having metallizations with less current-carrying capacity are created on one and the same ceramic substrate, wherein the following method steps are carried out sequentially:
- e) printing a common base metallization for the high-power area and the low-power areas from a glass-containing copper-based paste using screen printing or pad printing to a thickness of 20 to 50 μm,
- f) reinforcing the base metallization in the high-power areas by printing, several or many times, a copper-reinforcement paste without any glass component onto the base metallization by means of screen printing or stencil printing up to a total copper thickness of 300 to 500 μm,
- g) annealing the metallized ceramic substrate with the high-power areas and the low-power areas together at 850 to 950° C. in nitrogen,
- h) mechanical levelling of the high-power areas in order to create a planar surface with a roughness Rz<5 μm;
- wherein the glass component of the glass-containing copper-based paste is between 4 and 8%.
A method for producing a multi-level metallization of copper on a ceramic substrate comprising AlN, wherein high-power areas having metallizations with greater current-carrying capacity and low-power areas having metallizations with less current-carrying capacity are created on one and the same ceramic substrate, wherein the following method steps are carried out sequentially:
- e) printing a common base metallization for the high-power area and the low-power areas from a glass-containing copper-based paste using screen printing or pad printing to a thickness of 20 to 50 μm,
- f) reinforcing the base metallization in the high-power areas by printing, several or many times, a copper-reinforcement paste without any glass component onto the base metallization by means of screen printing or stencil printing up to a total copper thickness of 300 to 500 μm,
- g) annealing the metallized ceramic substrate with the high-power areas and the low-power areas together at 850 to 950° C. in nitrogen,
- h) mechanical levelling of the high-power areas in order to create a planar surface with a roughness Rz<5 μm;
- wherein the glass component of the glass-containing copper-based paste is between 4 and 8%.
Dependencies are inferred from the claim text.