Multilayered transient liquid phase bonding
AssigneeSkyworks Solutions, Inc.
InventorBradley Paul Barber
Life of this patent
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Abstract
A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.
Claims20
An electronic component package including a bonding structure comprising:
- a first layer of a first alloy component having an upper surface disposed on a substrate;
- a first interfacial barrier layer having an upper surface directly disposed on a lower surface of the first layer of the first alloy component;
- a first layer of a second alloy component having an upper surface disposed directly on a lower surface of the first interfacial barrier layer, the second alloy component having a lower melting temperature than the first alloy component;
- a second interfacial barrier layer having an upper surface directly disposed on a lower surface of the first layer of the second alloy component;
- a second layer of the first alloy component having an upper surface disposed directly on a lower surface of the second interfacial barrier layer;
- a third interfacial barrier layer having an upper surface directly disposed on a lower surface of the second layer of the first alloy component;
- and
- a second layer of the second alloy component having an upper surface disposed directly on a lower surface of the third interfacial barrier layer.
An electronic device including a bonding structure comprising:
- a first layer of a first binary component disposed on a substrate;
- a first barrier layer disposed directly on the first layer of the first binary component;
- a first layer of a second binary component disposed directly on the first barrier layer, the first barrier layer including a material that suppresses diffusion of the second binary component in the first layer of the second binary component into the first layer of the first binary component;
- a second barrier layer disposed directly on the first layer of the second binary component;
- a second layer of the first binary component disposed directly on the second barrier layer;
- a third barrier layer disposed directly on the second layer of the first binary component;
- a second layer of the second binary component layer disposed directly on the third barrier layer;
- and
- a fourth barrier layer disposed directly on the second layer of the second binary component, the fourth barrier layer including a material that suppresses diffusion of oxygen from the atmosphere into the second layer of the second binary component.
A wireless device having at least one module including a substrate having a radio frequency circuit and a first bonding structure configured to bond at least one device to a portion of the radio frequency circuit, the first bonding structure comprising:
- a first layer of a first alloy component disposed on a substrate;
- a first barrier layer having an upper surface directly disposed on a lower surface of the first layer of the first alloy component;
- a first layer of a second alloy component having an upper surface disposed directly on a lower surface of the first barrier layer, the second alloy component having a lower melting temperature than the first alloy component;
- a second barrier layer having an upper surface directly disposed on a lower surface of the first layer of the second alloy component;
- a second layer of the first alloy component having an upper surface disposed directly on a lower surface of the second barrier layer;
- a third barrier layer having an upper surface directly disposed on a lower surface of the second layer of the first alloy component;
- and
- a second layer of the second alloy component having an upper surface disposed directly on a lower surface of the third barrier layer.
Dependencies are inferred from the claim text.