Electronic device with embedded electronic component
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsChristian Galler, Gerhard Stubenberger, Markus Leitgeb, Wolfgang Schrittwieser
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Abstract
An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.
Claims17
An electronic device, comprising:
- a component carrier comprising a component carrier body, a substantially continuous electrically conductive layer, and an adhesive structure;
- an electronic component which is arranged within the component carrier body;
- wherein the adhesive structure is formed between a surface of the electronic component and the substantially continuous electrically conductive layer;
- wherein the adhesive structure covers a first part of the surface of the electronic component;
- wherein a remaining second part of the surface of the electronic component is covered with the component carrier body;
- and
- wherein all of the edge sections of the surface of the electronic component are free from the adhesive structure.
A method of manufacturing an electronic device, the method comprising:
- providing a component carrier comprising a component carrier body, a substantially continuous electrically conductive layer and an adhesive layer;
- applying the adhesive structure on the substantially continuous electrically conductive layer;
- equipping the component carrier with an electronic component by placing the electronic component on the adhesive structure, such that the adhesive structure covers a first part of the surface of the electronic component and such that all of the edge sections of the surface of the electronic component are free from the adhesive structure;
- embedding the electronic component within the component carrier body by laminating an electrically insulating structure of the component carrier body onto the electronic component, such that a remaining second part of the surface of the electronic component is covered with the electrically insulating structure of the component carrier body.
Dependencies are inferred from the claim text.