Ceramic and polymer composite, and uses thereof
AssigneeCorning Incorporated
InventorsWeiguo Miao, Manuela Ocampo, Michael Lesley Sorensen, James William Zimmermann
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Abstract
A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.
Claims10
A printed circuit board comprising a ceramic and polymer composite comprising:
- a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity of from 50 to 15 vol %, based on the total volume of the composite;
- and
- a second continuous polymer phase situated in the porosity of the sintered porous ceramic first continuous phase,
- wherein the composite is a sheet having a thickness of from 10 to 100 micrometers;
- wherein the printed circuit board has a frequency dielectric constant of from 2.4 to 6.7 at 10 GHz.
A ceramic and polymer composite comprising:
- a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity of from 50 to 15 vol %, based on the total volume of the composite;
- and
- a second continuous polymer phase situated in the porosity of the sintered porous ceramic first continuous phase,
- wherein the composite has:
- a Young's modulus of from 50 to 250 GPa;
- and
- a coefficient of thermal expansion (CTE) of from 11×10−6 K−1 to 25×10−6 K−1 in each of the x, y, and z axes.
Dependencies are inferred from the claim text.