US 10,568,204 B2 · Conformal 3D non-planar multi-layer circuitry

Abstract

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

Claims14

Dependent claims

A conformal non-planar multi-layer circuit, comprising:

a substrate having a first non-planar surface;
a conformal circuitry layer over the substrate, the conformal circuitry layer conforming to the first non-planar surface of the substrate, and the conformal circuitry layer having a second non-planar surface;
a first conformal dielectric layer over the substrate,
wherein the first conformal dielectric layer conforms to the second non-planar surface of the substrate,
wherein the first conformal dielectric layer has a third non-planar surface, and
wherein the first conformal dielectric layer includes at least one micro via exposing the conformal circuitry layer;
and
a copper circuitry layer over the conformal circuitry layer, the copper circuitry layer conforming to the third non-planar surface of the first conformal dielectric layer, and the copper circuitry layer having a fourth non-planar surface, wherein the copper circuitry layer contacts the conformal circuitry layer through the at least one micro via.

5 more elements

Dependencies are inferred from the claim text.

Conformal 3D non-planar multi-layer circuitry

Life of this patent

Conformal 3D non-planar multi-layer circuitry

Life of this patent

Abstract

Claims14