Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

A tamper-respondent assembly comprising:

• at least one electronic component;
• an enclosure surrounding, at least in part, the at least one electronic component;
• at least one tamper-respondent sensor associated with the enclosure and facilitating defining a secure volume about the at least one electronic component, the at least one tamper-respondent sensor including:
• conductive lines forming, at least in part, at least one tamper-detect network of the at least one tamper-respondent sensor;
• and
• at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the at least one tamper-detect network, the at least one interconnect element comprising at least one interconnect characteristic selected to facilitate obscuring a circuit layout of the at least one tamper-detect network;
• a detector to monitor the at least one tamper-detect network of the at least one tamper-respondent sensor for a tamper event;
• and
• wherein:
• the at least one tamper-respondent sensor comprises at least one layer, and different conductive lines of the conductive lines are disposed on different surfaces of the at least one layer, and the at least one interconnect element comprises multiple interconnect vias between the different conductive lines disposed on the different surfaces;
• an interconnect via of the multiple interconnect vias is undetectable via x-ray analysis;
• an other interconnect via of the multiple interconnect vias comprises a fictitious interconnect via not electrically connecting two or more different conductive lines;
• the interconnect via and the other interconnect via are formed of different interconnect materials;
• and
• the other interconnect via is detectable by x-ray, appearing in x-ray analysis to be an actual electrical interconnect via.